These materials provide unrivaled thermal and mechanical performance while inducing virtually zero stress on electronic components during assembly, helping you improve performance and reliability across your device assemblies.

Because they’re liquid mediums, thermal gap filler materials can conform to highly intricate topographies and multi-level surfaces. This allows them to deliver better wet-out for optimized thermal resistance, generally lower than more solid pad-based mediums. 

Application volume and pattern are completely adaptable to suit a wide range of applications.

Bergquist Gap Filler TGF 3600(3500S35) 50cc