31 & 41, Jalan Cemerlang,
Taman Perindustrian Cemerlang,
81800 Ulu Tiram,
Johor Darul Takzim, Malaysia.
Thermal management materials are a range of different product types designed to effectively dissipate heat in electronic applications. They are composite systems that enable efficient heat transfer within components.
These solutions perform various functions within components. This includes carrying heat away from the components that generate it (also known as dissipating heat), offering stress relief from thermal cycling, providing electrical insulation, filling gaps, and offering long-term stability within components.
Thermal management materials have an important role to play as electronic devices become increasingly powerful and generate more heat. Without effective thermal management, manufacturers can face:
Selecting the right thermal management material for your application depends on several factors, including:
Knowing the requirements in your application for each of the above can help you decide whether you need a resin, liquid, or solid-state thermal management solution and whether pads, liquids, adhesives, tapes, or films are the right thermal product for use in your assembly.
For more information on how to select the right thermal interface materials, check out our guide on selecting the right thermal material for your needs.
Gap fillers are thermally conductive gap filling liquid materials designed to enhance thermal performance and enable easier dispensing application for your high-volume manufacturing operations.
These materials provide unrivaled thermal and mechanical performance while inducing virtually zero stress on electronic components during assembly, helping you improve performance and reliability across your device assemblies. Because they’re liquid mediums, thermal gap filler materials can conform to highly intricate topographies and multi-level surfaces. This allows them to deliver better wet-out for optimized thermal resistance, generally lower than more solid pad-based mediums. Application volume and pattern are completely adaptable to suit a wide range of applications. | |||
![]() Bergquist Gap Filler TGF 3600(3500S35) 50cc | |||
RM 250.00Add to Cart | |||
SIL PAD products can be used in a wide range of applications. Choose the ideal product from the portfolio for your needs. Discover products available with or without adhesives, as well as silicone thermal interface and non-silicone material alternatives. SIL PAD products are available to buy in several formats, including rolls, sheets, tubes, and as custom die-cut parts. | |||
![]() Sil Pad TSP 3500 | |||
RM 750.00Add to Cart |
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