Thermal management materials are a range of different product types designed to effectively dissipate heat in electronic applications. They are composite systems that enable efficient heat transfer within components.

These solutions perform various functions within components. This includes carrying heat away from the components that generate it (also known as dissipating heat), offering stress relief from thermal cycling, providing electrical insulation, filling gaps, and offering long-term stability within components. 

Thermal management materials have an important role to play as electronic devices become increasingly powerful and generate more heat. Without effective thermal management, manufacturers can face: 

• - System reliability drops
• - Product performance failure
• - Limited design advancement potential
• - Degradation over time
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• Optimizing heat dissipation
• Extending the life of components
• Upholding performance of devices
• Eliminating the risk of failure and performance drops

Selecting the right thermal management material for your application depends on several factors, including: 

• Heat dissipation requirements
• Adhesive qualities needed in assembly
• Whether a solid or liquid is more applicable
• The size of the gap that needs to be filled
• Gap topography and surface
• Component stress level requirements
• Physics, including application temperature and structure

Knowing the requirements in your application for each of the above can help you decide whether you need a resin, liquid, or solid-state thermal management solution and whether pads, liquids, adhesives, tapes, or films are the right thermal product for use in your assembly.

For more information on how to select the right thermal interface materials, check out our guide on selecting the right thermal material for your needs.